鼎博体育 offers a diverse array of value-added semiconductor services, enabling customers to focus on core competencies and accelerate demand for products
鼎博体育 is committed to being a resourceful partner in our customer’s supply chain so production and distribution can be achieved at the lowest possible total cost.
Whether it’s getting involved early in the electrical and thermal characterization design phase, creating the optimum package or conducting wafer probe, or test in our facilities located worldwide, 鼎博体育 will help make better decisions for a superior performing product.
The combination of our comprehensive engineering support and convenient online Customer Center allows customers to extract further value from partnership with 鼎博体育 and significantly reduces operational risk.
Leaders in next generation package design
Superior mechanical, thermal and electrical package characterization to meet end-market requirements
Advanced test solutions for customer requirements
State-of-the-art wafer bumping capabilities